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[Problem Solving Case] Metal Substrate Interface

A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!

We would like to introduce a case study regarding the resolution of the "metal substrate interface" issue that we addressed. The customer company was experiencing problems where stress on the solder joints caused by warping and thermal expansion/contraction of the substrate occurred when reflow soldering daughter boards to a metal motherboard, leading to issues such as cracks. We alleviated the stress on the solder joints by designing the pin header terminals in a wave shape, successfully resolving the issue. 【Case Overview】 ■ Customer's Concern - Stress on the solder joints caused by warping and thermal expansion/contraction of the substrate leads to issues such as cracks. ■ Solution - Designed the pin header terminals in a wave shape to alleviate stress on the solder joints. *For more details, please download the PDF or feel free to contact us.

• Company：アイクレックス
• Price：Other

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